Mark your calendar and save the date to attend the 2019 Semiconductor Advanced Packaging Workshop on
24th September 2019 at Eastin Hotel, Penang or 25th September 2019 at New World Hotel, Petaling Jaya.
Participants will get a chance to meet and be inspired by two IEEE renowned speakers who will be sharing their expertise in the most recent packaging trends and development of emerging technologies……
Hurry up and sign up ONLINE today to enjoy early bird fees!!!
***Exclusive privilege for IEEE Members and students***


Participants are strongly encouraged to register and make the payment via the e-registration link provided above. Kindly contact 1300881588 for necessary technical assistance.
Please email Organizer/ IEEE EPS Malaysia through [email protected]
- For general query on workshop and,
- For group registration of 5 participants and above
Join IEEE-EPS Malaysia Chapter
Become a member of IEEE-EPS Malaysia Section and enjoy big discounts on our future seminars. Here is how to become a member.
1. Membership application info is at: https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=MEMEP021
2. Membership benefit: http://www.ieee.org/membership_services/membership/benefits/index.html
3. EPS home page: https://ieee-epsmalaysia.org/
Note:
Guidance of HRDF claim
2019 Semiconductor Advanced Packaging Workshop Flyer
Course Outline with instructors Biography & Syllabus.