2019 Semiconductor Advanced Packaging Workshop

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Mark your calendar and save the date to attend the 2019 Semiconductor Advanced Packaging Workshop on 

24th September 2019 at Eastin Hotel, Penang or 25th September 2019 at New World Hotel, Petaling Jaya.


Participants will get a chance to meet and be inspired by two IEEE renowned speakers who will be sharing their expertise in the most recent packaging trends and development of emerging technologies……

Hurry up and sign up ONLINE today to enjoy early bird fees!!!

***Exclusive privilege for IEEE Members and students***


Participants are strongly encouraged to register and make the payment via the e-registration link provided above. Kindly contact 1300881588 for necessary technical assistance.


Please email Organizer/ IEEE EPS Malaysia through [email protected]

  1. For general query on workshop and, 
  2. For group registration of 5 participants and above



Join IEEE-EPS Malaysia Chapter

Become a member of IEEE-EPS Malaysia Section and enjoy big discounts on our future seminars. Here is how to become a member.

1. Membership application info is at: https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=MEMEP021

2. Membership benefit: http://www.ieee.org/membership_services/membership/benefits/index.html

3. EPS home page: https://ieee-epsmalaysia.org/



Note:
Guidance of HRDF claim

2019 Semiconductor Advanced Packaging Workshop Flyer

Course Outline with instructors Biography & Syllabus.



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Refund Policy


1. If a registrant is unable to attend the event for any reason they may
    transfer the registration to someone else (e.g., a colleague) for the same
    workshop (i.e., same date[s] and location[s]).

2. Registrants who cancel their registration for any reason (including the
    denial of a travel visa due to delays or other issues) will receive a partial
    refund according to the following schedule:

·Registrations cancelled more than 30 days before the event will be refunded 80% of the registration fees.

·Registrations cancelled less than 30 days before the event will not be eligible for a refund.

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IEEE EPS MALAYSIA

The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences.
Scan & Share
http://t2u.asia/e/13046 

2019 Semiconductor Advanced Packaging Workshop

Online Event

Event Expired

Ticket Information

Mark your calendar and save the date to attend the 2019 Semiconductor Advanced Packaging Workshop on 

24th September 2019 at Eastin Hotel, Penang or 25th September 2019 at New World Hotel, Petaling Jaya.


Participants will get a chance to meet and be inspired by two IEEE renowned speakers who will be sharing their expertise in the most recent packaging trends and development of emerging technologies……

Hurry up and sign up ONLINE today to enjoy early bird fees!!!

***Exclusive privilege for IEEE Members and students***


Participants are strongly encouraged to register and make the payment via the e-registration link provided above. Kindly contact 1300881588 for necessary technical assistance.


Please email Organizer/ IEEE EPS Malaysia through [email protected]

  1. For general query on workshop and, 
  2. For group registration of 5 participants and above



Join IEEE-EPS Malaysia Chapter

Become a member of IEEE-EPS Malaysia Section and enjoy big discounts on our future seminars. Here is how to become a member.

1. Membership application info is at: https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=MEMEP021

2. Membership benefit: http://www.ieee.org/membership_services/membership/benefits/index.html

3. EPS home page: https://ieee-epsmalaysia.org/



Note:
Guidance of HRDF claim

2019 Semiconductor Advanced Packaging Workshop Flyer

Course Outline with instructors Biography & Syllabus.



Terms and Condition

Refund Policy


1. If a registrant is unable to attend the event for any reason they may
    transfer the registration to someone else (e.g., a colleague) for the same
    workshop (i.e., same date[s] and location[s]).

2. Registrants who cancel their registration for any reason (including the
    denial of a travel visa due to delays or other issues) will receive a partial
    refund according to the following schedule:

·Registrations cancelled more than 30 days before the event will be refunded 80% of the registration fees.

·Registrations cancelled less than 30 days before the event will not be eligible for a refund.

 
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences.
Event Links
http://t2u.asia/e/13046 
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