Venue: 15th October 2025 at G Hotel Gurney, Penang or 17th October 2023 at Bangi Resort Hotel, Selangor
The Semiconductor Advanced Packaging Workshop is the biennial event providing participant an opportunity to meet and learn from two IEEE renowned speakers who will be sharing their expertise in the most recent packaging trends and development of emerging technologies. This event is organized by the IEEE EPS Malaysia Chapter.
Workshop Session 1: “Introduction to and Advances in 2.3D Fan-Out Wafer & Panel Level Packaging ”
by Dr. Beth Keser
This workshop provides an overview of 2.5D and 3D Fan-Out Wafer and Panel Level Packaging technologies, focusing on their fundamentals, recent advancements, and applications in advanced semiconductor packaging. Participants will gain insights into the design, materials, and manufacturing processes that enable higher performance, miniaturization, and integration in modern electronic devices.
Workshop Session 2: “Package Reliability Management ”
by Dr. Lee Teck Kheng
This 2.5-hour course offers a practical introduction to package reliability management in the semiconductor industry. Aimed at professionals across disciplines, it highlights how design and material choices impact reliability. The session begins with an overview of reliability testing and standards, followed by a deep dive into common failure mechanisms under mechanical, electrical, and chemical stress. Participants will explore thermo-mechanical, chemical, and electrical failure modes, and learn to apply failure analysis tools to investigate and address these issues. Designed for directors, managers, process and R&D engineers, the course is also valuable for sales and application engineers, providing insights into key reliability challenges and helping drive more informed decisions in packaging design and materials.
